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Supermicro MEM-DR380L-HV01-ER13 Datasheet

Browse online or download Datasheet for Memory modules Supermicro MEM-DR380L-HV01-ER13. Supermicro HMT41GV7BMR4C-H9 User Manual

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HMT41GV7BMR4C-G7/H9
SERIAL PRESENCE DETECT
Function described Function support HEX Function support HEX Function support HEX Function support HEX
0
CRC Coverage/SPD Device Size/Number of Serial PD Bytes written
116/256/176 Bytes 92 116/256/176 Bytes 92 116/256/176 Bytes 92 116/256/176 Bytes 92
1
SPD Revision
1.0 10 1.0 10 1.0 10 1.0 10
2
DRAM Device Type
DDR3 SDRAM 0B DDR3 SDRAM 0B DDR3 SDRAM 0B DDR3 SDRAM 0B
3
Module Type
Registered DIMM 01 Registered DIMM 01 Registered DIMM 01 Registered DIMM 01
4
SDRAM Density and Banks
8 banks, 2Gb 03 8 banks, 2Gb 03 8 banks, 2Gb 03 8 banks, 2Gb 03
5
SDRAM Addressing(Row/Column)
15 / 11 1A 15 / 11 1A 15 / 11 1A 15 / 11 1A
6
Module Nominal Voltage, VDD
Only 1.5V Operable 00 Only 1.5V Operable 00 Only 1.5V Operable 00 Only 1.5V Operable 00
7
Module Organization (rank / data bit width)
2rank/x4 08 2rank/x4 08 2rank/x4 08 2rank/x4 08
8
Module Memory Bus Width
ECC/ 72bit bus 0B ECC/ 72bit bus 0B ECC/ 72bit bus 0B ECC/ 72bit bus 0B
9
Fine Timebase Dividened and Divisor
5ps / 2 52 5ps / 2 52 5ps / 2 52 5ps / 2 52
10
Medium Timebase Dividened
1ns 01 1ns 01 1ns 01 1ns 01
11
Medium Timebase Divisor
8 08 8 08 8 08 8 08
12
Minimum SDRAM Cycle Time(tCKmin)
1.875ns 0F 1.875ns 0F 1.5ns 0C 1.5ns 0C
13
Reserved
Blank 00 Blank 00 Blank 00 Blank 00
14
SDRAM CAS Latency Supported, Low Byte
6,7,8 1C 6,7,8 1C 6,7,8,9 3C 6,7,8,9 3C
15
~~~~SDRAM CAS Latency Supported, High Byte Not support over CL=12 00 Not support over CL=12 00 Not support over CL=12 00 Not support over CL=12 00
16
Minimum CAS Latency Time(tAAmin)
13.125 ns 69 13.125 ns 69 13.125ns 69 13.125ns 69
17
Minimum Write Recovery Time(tWRmin)
15ns 78 15ns 78 15ns 78 15ns 78
18
Minimum /RAS to /CAS Delay (tRCDmin)
13.125 ns 69 13.125 ns 69 13.125ns 69 13.125ns 69
19
Minimun Row Active to Row Active Delay (tRRDmin)
7.5ns 3C 7.5ns 3C 6ns 30 6ns 30
20
Minimum Row Precharge Delay Time (tRPmin)
13.125 ns 69 13.125 ns 69 13.125ns 69 13.125ns 69
21
Upper Nibbles for tRAS and tRC
Refer to Byte22,23 11 Refer to Byte22,23 11 Refer to Byte22,23 11 Refer to Byte22,23 11
22
Minimum Active to Precharge Delay Time (tRASmin), Least Significant Byte
37.5 ns
2C
37.5 ns
2C
36ns
20
36ns
20
23
~~~~Minimum Active to Active/Refresh Delay Time (tRCmin), Least Significant Byte
50.625 ns 95 50.625 ns 95 49.125 ns 89 49.125 ns 89
24
Minimum Refresh Recovery Time(tRFCmin), Least Significant Byte
160ns 00 160ns 00 160ns 00 160ns 00
25
~~Minimum Refresh Recovery Time(tRFCmin), Least Significant Byte
160ns 05 160ns 05 160ns 05 160ns 05
26
Minimum Internal Write to Read Command Delay Time(tWTRmin)
7.5ns 3C 7.5ns 3C 7.5ns 3C 7.5ns 3C
27
Minimum Internal Read to Precharge Command Delay Time(tRTPmin)
7.5ns 3C 7.5ns 3C 7.5ns 3C 7.5ns 3C
28
Upper Nibble for tFAW
Refer to Byte29 01 Refer to Byte29 01 Refer to Byte29 00 Refer to Byte29 00
29
~~~~Minimum Four Active Window Delay Time(tFAW), Least Significant Byte
37.5 ns 2C 37.5 ns 2C 30 ns F0 30 ns F0
30
SDRAM Output DriverSupported
DLL Off, RZQ/6, RZQ/7 83 DLL Off, RZQ/6, RZQ/7 83 DLL Off, RZQ/6, RZQ/7 83 DLL Off, RZQ/6, RZQ/7 83
31
SDRAM Thermal and Refresh Options
ASR, Normal Temp 05 ASR, Normal Temp 05 ASR, Normal Temp 05 ASR, Normal Temp 05
32
Module Thermal Sensor
TS incorporated
80
TS incorporated
80
TS incorporated
80
TS incorporated
80
33
SDRAM Device Type
DDP 80 DDP 80 DDP 80 DDP 80
34~59
Reserved
Blank 00 Blank 00 Blank 00 Blank 00
60
Module Nominal Height of Unbuffered Dimm
19.4mm 05 19.4mm 05 19.4mm 05 19.4mm 05
61
Module Maximum Thickness of unbuffered DIMM
3~4mm 33 3~4mm 33 3~4mm 33 3~4mm 33
62
Reference Raw Card Used for unbuffered DIMM
rev 0.0 / RC N 0C rev 0.0 / RC N 0C rev 0.0 / RC N 0C rev 0.0 / RC N 0C
63
DIMM Module Attributes
1Row 1Register 05 1Row 1Register 05 1Row 1Register 05 1Row 1Register 05
64
Heat Spreader Solution
Present 80 Present 80 Present 80 Present 80
65
Register Vendor ID (LSB)
Inphi 04 IDT 80 Inphi 04 IDT 80
66
Register Vendor ID (MSB)
Inphi B3 IDT B3 Inphi B3 IDT B3
67
Register Revision Number
GS-02 LV 11 B 61 GS-02 LV 11 B 61
68
Register Type
SSTE32882 00 SSTE32882 00 SSTE32882 00 SSTE32882 00
69
Register Control Word Function RC1 / RC0
rev 0.0 / RC N 00 rev 0.0 / RC N 00 rev 0.0 / RC N 00 rev 0.0 / RC N 00
70
Register Control Word Function RC 3 / RC 2
rev 0.0 / RC N A0 rev 0.0 / RC N A0 rev 0.0 / RC N A0 rev 0.0 / RC N A0
71
Register Control Word Function RC 5 / RC 4
rev 0.0 / RC N 55 rev 0.0 / RC N 55 rev 0.0 / RC N 55 rev 0.0 / RC N 55
72
Reserved
Blank 00 Blank 00 Blank 00 Blank 00
73
Reserved
Blank 00 Blank 00 Blank 00 Blank 00
74
Register Control Word Function RC11 / RC10
Inphi 1.5V for RC11 00 IDT 1.5V for RC11 00 Inphi 1.5V for RC11 00 IDT 1.5V for RC11 00
75~116
Reserved
Blank 00 Blank 00 Blank 00 Blank 00
117
Module Manufacturer JEDEC ID Code, Least Significant Byte
Hynix 80 Hynix 80 Hynix 80 Hynix 80
118
~~~~Module Manufacturer JEDEC ID Code, Most Significant Byte
Hynix AD Hynix AD Hynix AD Hynix AD
119
Module Manufacturing location
Hynix(Ichon) 01 Hynix(Ichon) 01 Hynix(Ichon) 01 Hynix(Ichon) 01
120
Module Manufacturing Data (Year)
Variable 00 Variable 00 Variable 00 Variable 00
121
Module Manufacturing Data (Week)
Variable 00 Variable 00 Variable 00 Variable 00
122~125
Module Serial Number
Undefined 00 Undefined 00 Undefined 00 Undefined 00
126
Cyclical Redundancy Code
CRC cover 0~116 byte 9A CRC cover 0~116 byte 82 CRC cover 0~116 byte D8 CRC cover 0~116 byte C0
127
~~~~Cyclical Redundancy Code
CRC cover 0~116 byte AC CRC cover 0~116 byte 92 CRC cover 0~116 byte 05 CRC cover 0~116 byte 3B
128
Manufacture part number ( Hynix Memory Module )
H 48 H 48 H 48 H 48
129
~~~~Manufacture part number ( Hynix Memory Module )
M 4D M 4D M 4D M 4D
130
Component Group (DDR3 SDRAM)
T 54 T 54 T 54 T 54
131
Component Density
4 34 4 34 4 34 4 34
132
Manufacture part number ( Memory Depth )
1 31 1 31 1 31 1 31
133
~~~~Manufacture part number ( Memory Depth)
G 47 G 47 G 47 G 47
134
Manufacture part number ( Module type )
V 56 V 56 V 56 V 56
135
Manufacture part number ( Data width )
7 37 7 37 7 37 7 37
136
Manufacture part number ( Die generation)
B 42 B 42 B 42 B 42
137
Manufacture part number ( Package Type)
M 4D M 4D M 4D M 4D
138
Manufacture part number ( Package Material)
R 52 R 52 R 52 R 52
139
Manufacture part number ( Component configuration)
4 34 4 34 4 34 4 34
140
Manufacture part number ( Power consumption & Temp.)
C 43 C 43 C 43 C 43
141
Manufacture part number ( Hyphen )
- 2D - 2D - 2D - 2D
142
Manufacture part number ( Speed)
G 47 G 47 H 48 H 48
143
~~~~Manufacture part number ( Speed)
7 37 7 37 9 39 9 39
144
Manufacture part number
Blank 20 Blank 20 Blank 20 Blank 20
145
Manufacture part number
Blank 20 Blank 20 Blank 20 Blank 20
146
Module Revision Code
D 44 D 44 D 44 D 44
147
~~~Module Revision Code
2 32 7 37 2 32 7 37
148
DRAM Manufacturer JEDEC ID Code, Least Significant Byte
Hynix 80 Hynix 80 Hynix 80 Hynix 80
149
~~~~DRAM Manufacturer JEDEC ID Code, Most Significant Byte
AD AD AD AD
150~175
Manufacturer's Specific Data
Blank 00 Blank 00 Blank 00 Blank 00
176~255
Open for customer use
Blank 00 Blank 00 Blank 00 Blank 00
H9 D2
H9 D7
G7 D7
G7 D2
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1

Summary of Contents

Page 1 - SERIAL PRESENCE DETECT

HMT41GV7BMR4C-G7/H9SERIAL PRESENCE DETECTFunction described Function support HEX Function support HEX Function support HEX Function support HEX0CRC Co

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